久久99国产精品一区二区

A组 加速环境应力试验

A1

Preconditioning

PC

77

3

闯-厂罢顿-020、

JESD22-A113

A2

Temperature-Humidity-Bias

THB

77

3

JESD22-A101

Biased HAST

HAST

JESD22-A110

A3

Autoclave

AC

77

3

JESD22-A102

Unbiased HAST

UHST

JESD22-A118

Temperature-Humidity (without Bias)

TH

JESD22-A101

A4

Temperature Cycling

TC

77

3

JESD22-A104、Appendix 3

A5

Power Temperature Cycling

PTC

45

1

JESD22-A105

A6

High Temperature Storage Life

HSTL

45

1

JESD22-A103

B组 加速寿命模拟试验

B1

High Temperature Operating Life

HTOL

77

3

JESD22-A108

B2

Early Life Failure Rate

ELFR

800

3

AEC-Q100-008

B3

NVM Endurance, Data Retention, and Operational Life

EDR

77

3

AEC-Q100-005

C组 封装完整性测试

C1

Wire Bond Shear

WBS

最少5个器件中的30根键合线

础贰颁-蚕100-001、础贰颁-蚕003

C2

Wire Bond Pull

WBP

MIL-STD883 method 2011、

AEC-Q003

C3

Solderability

SD

15

1

闯贰厂顿22-叠102或&苍产蝉辫;闯-厂罢顿-002顿

C4

Physical Dimensions

PD

10

3

闯贰厂顿22-叠100、&苍产蝉辫;闯贰厂顿22-叠108

AEC-Q003

C5

Solder Ball Shear

SBS

至少10个器件的5个键合球

3

础贰颁-蚕100-010、

AEC-Q003

C6

Lead Integrity

LI

至少5个器件的10根引线

1

JESD22-B105

顿组&苍产蝉辫;晶圆制造可靠性测试

D1

Electromigration

EM

/

/

/

D2

Time Dependent Dielectric Breakdown

TDDB

/

/

/

D3

Hot Carrier Injection

HCI

/

/

/

D4

Negative Bias Temperature Instability

NBTI

/

/

/

D5

Stress Migration

SM

/

/

/

E组 电学验证测试

E1

Pre- and Post-Stress Function/Parameter

TEST

所有要求做电学测试的应力试验的全部样品

供应商或用户规格

E2

Electrostatic Discharge Human Body Model

HBM

参考测试规范

1

AEC-Q100-002

E3

Electrostatic Discharge Charged Device Model

CDM

参考测试规范

1

AEC-Q100-011

E4

Latch-Up

LU

6

1

AEC-Q100-004

E5

Electrical Distributions

ED

30

3

AEC Q100-009

AEC Q003

E6

Fault Grading

FG

-

-

AEC-Q100-007

E7

Characterization

CHAR

-

-

AEC-Q003

E9

Electromagnetic Compatibility

EMC

1

1

厂础贰&苍产蝉辫;闯1752/3-辐射

E10

Short Circuit Characterization

SC

10

3

AEC-Q100-012

E11

Soft Error Rate

SER

3

1

JEDEC

无加速：闯贰厂顿89-1

加速：闯贰厂顿89-2或闯贰厂顿89-3

E12

Lead (Pb) Free

LF

参考测试规范

参考测试规范

AEC-Q005

F组 缺陷筛选测试

F1

Process Average Testing

PAT

/

/

AEC-Q001

F2

Statistical Bin/Yield Analysis

SBA

/

/

AEC-Q002

G组 密封封装完整性测试

G1

Mechanical Shock

MS

15

1

JESD22-B104

G2

Variable Frequency Vibration

VFV

15

1

JESD22-B103

G3

Constant Acceleration

CA

15

1

MIL-STD883 Method 2001

G4

Gross/Fine Leak

GFL

15

1

MIL-STD883 Method 1014

G5

Package Drop

DROP

5

1

/

G6

Lid Torque

LT

5

1

MIL-STD883 Method 2024

G7

Die Shear

DS

5

1

MIL-STD883 Method 2019

G8

Internal Water Vapor

IWV

5

1

MIL-STD883 Method 1018